- Attachment Method:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Shape:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Filter:
173 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 45 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 2.6W... |
|
19
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 6.5W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4.7W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 2.3W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, BGA, 8.5... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4W ... |
|
72
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4W ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, STAMPI... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, BGA, 17 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4.8W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, BGA, 20 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4.6W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now |





