Русский язык
简体中文
بالعربية
Türkçe
Português
ภาษาไทย
Deutsch
한어
FrançaisHSS14-B20-NP
- Mfr.Part #
- HSS14-B20-NP
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
-
Download
- Description
- HEAT SINK, STAMPING, TO-220, 19.
- Stock
- 35000
Request A Quote(RFQ)
- * Contact Name:
- * Company:
- * E-Mail:
- * Phone:
- * Comment:
- * Captcha:
-
- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- -
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-220
- Power Dissipation @ Temperature Rise :
- 3.1W @ 75°C
- Product Status :
- Active
- Shape :
- Rectangular
- Thermal Resistance @ Forced Air Flow :
- 11.60°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 23.91°C/W
- Type :
- Board Level, Vertical
- Datasheets
- HSS14-B20-NP
Manufacturer related products
Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| HSS10-B20-P40 | CUI Devices | 2,893 | HEAT SINK, STAMPING, TO-220, 29. |
| HSS104-02TA-E | Intersil (Renesas Electronics Corporation) | 35,000 | DIODE FOR HIGH SPEED SWITCHING |
| HSS104-02TE-E | Intersil (Renesas Electronics Corporation) | 70,000 | DIODE FOR HIGH SPEED SWITCHING |
| HSS104-E | Intersil (Renesas Electronics Corporation) | 35,000 | RECTIFIER DIODE, 0.11A |
| HSS104TA-E | Intersil (Renesas Electronics Corporation) | 40,000 | RECTIFIER DIODE, 0.11A |
| HSS10F1.5AS | SolaHD | 35,000 | PWR XFMR LAMINATED 1500VA CHAS |
| HSS10F10AS | SolaHD | 35,000 | PWR XFMR LAMINATED 10000VA CHAS |
| HSS10F1BS | SolaHD | 35,000 | PWR XFMR LAMINATED 1000VA CHAS |
| HSS10F2AS | SolaHD | 35,000 | PWR XFMR LAMINATED 2000VA CHAS |
| HSS10F3AS | SolaHD | 35,000 | PWR XFMR LAMINATED 3000VA CHAS |
| HSS10F500B | SolaHD | 35,000 | PWR XFMR LAMINATED 500VA CHAS MT |
| HSS10F5AS | SolaHD | 35,000 | PWR XFMR LAMINATED 5000VA CHAS |
| HSS10F7.5AS | SolaHD | 35,000 | PWR XFMR LAMINATED 7500VA CHAS |
| HSS10F750B | SolaHD | 35,000 | PWR XFMR LAMINATED 750VA CHAS MT |
| HSS11-B20-P38 | CUI Devices | 2,215 | HEAT SINK, STAMPING, TO-220, 50. |
