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Français- Manufacturer：
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- CUI Devices (3)
- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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13 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
121
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
107
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
332
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,957
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
646
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
46
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
58
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
32
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
100
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
80
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
|
71
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK FOR TO92 |
|
35,000
In-stock
|
Details Buy Now |
