The first level: Inspection on packaging and label (checking if the packing conform with MSL level standa rds and Label if originality or not) |
| The second level: Visual inspection on actual body (Inspect whether the chip is brand new, refurbished, and whether the pins are coated with tin, oxidized, etc.) |
| The third level : X-ray, Decapsulation, electrical pe rformance testing (Detection of internal cracks and flaws in metal materials, plastic materials and electronic components) |
Note: Hi-Tech Circuit provides third-party testing service to meet the needs of different customers.