- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Shape:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Filter:
173 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, BGA, 40 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, BGA, 35 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4.1W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 2.3W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4.4W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 4.4W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
CUI Devices | HEATSINK TO-220 3.9W... |
|
35,000
In-stock
|
Details Buy Now |





