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Français- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Filter：
173 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
300
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
315
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
214
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
|
129
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
|
415
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
|
283
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
|
166
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
|
117
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
|
323
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
|
333
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
|
750
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
|
376
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
610
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
|
524
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
433
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
990
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
14
In-stock
|
Details Buy Now |
