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Français- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Filter：
173 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,230
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,542
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,582
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 37.... |
|
665
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,197
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,118
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 43.... |
|
1,081
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,572
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
992
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
999
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
|
223
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
|
545
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
605
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
960
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
|
780
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
646
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
|
700
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
|
239
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
|
712
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
703
In-stock
|
Details Buy Now |
