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Français- Manufacturer：
-
- CUI Devices (23)
- iWave Systems (3)
- Ohmite (42)
- Seeed (3)
- Wakefield Thermal (33)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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118 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
15,288
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,208
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
3,194
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
1,499
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
144
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
236
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
77
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
126
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
146
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
129
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
230
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
625
In-stock
|
Details Buy Now | ||
|
|
Seeed | ALUMINUM HEATSIN... |
|
252
In-stock
|
Details Buy Now | ||
|
|
ASSMANN WSW Components | HEATSINK CPU STA... |
|
5,233
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
196
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
107
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,987
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,355
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,657
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
3,000
In-stock
|
Details Buy Now |
