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Français- Manufacturer：
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- CUI Devices (2)
- Material：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
|
1,433
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
|
239
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
|
9
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
|
2
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
|
3
In-stock
|
Details Buy Now |
