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Français- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
|
34
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM S... |
|
94
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM F... |
|
89
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 21X15MM D... |
|
81
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X14.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK EXTRUSI... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
0.000
|
35,000
In-stock
|
Details Buy Now |
