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Français- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Type：
-
3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,197
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
992
In-stock
|
Details Buy Now |
